Technical Introduction: Embossed Taping Process
Equipped with an automatic visual inspection device! Visual inspection can be performed simultaneously with taping!
We would like to introduce the technology of the emboss taping process at Niigata Seimitsu Co., Ltd. The emboss taping process can accommodate taping of products (such as wafers, devices, modules, etc.) attached to rings (ring to taping) as well as taping of products stored in chip trays and JEDEC trays (tray to taping). Additionally, an automatic visual inspection device mounted on the emboss taping machine allows for visual inspection to be conducted simultaneously with the taping process. 【Features】 ■ Supports taping of products attached to rings ■ Supports taping of products stored in chip trays and JEDEC trays ■ Equipped with an automatic visual inspection device ■ Allows for visual inspection simultaneously with taping *For more details, please refer to the PDF document or feel free to contact us.
- Company：新潟精密
- Price：Other
